Theory for electromigration failure in Cu conductors
- J.R. Lloyd
- C.E. Murray
- et al.
- 2005
- International Workshop on Stress-Induced Phenomena in Metallization 2005
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28 results for J.R. Lloyd
Effect of moisture on the Time Dependent Dielectric Breakdown (TDDB) behavior in an ultra-low-k (ULK) dielectric
- J.R. Lloyd
- T.M. Shaw
- et al.
- 2005
- IIRW 2005
Microstructure evolution of tin under electromigration studied by synchrotron x-ray micro-diffraction
- Albert T. Wu
- J.R. Lloyd
- et al.
- 2005
- APM 2005
Reliability challenges with ultra-low k interlevel dielectrics
- J.R. Lloyd
- M. Lane
- et al.
- 2004
- Microelectronics Reliability
Time dependent dielectric breakdown in a low-k interlevel dielectric
- J.R. Lloyd
- E. Liniger
- et al.
- 2004
- Microelectronics Reliability
Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- R. Filippi
- J.F. McGrath
- et al.
- 2004
- IRPS 2004
Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- R. Filippi
- J.F. McGrath
- et al.
- 2004
- IRPS 2004
Characterization of Interconnect Defects due to Electromigration using Scanning Thermal Microscopy
- E.X.W. Wu
- X.H. Zheng
- et al.
- 2003
- ISTFA 2003
Relationship between interfacial adhesion and electromigration in Cu metallization
- J.R. Lloyd
- M.W. Lane
- et al.
- 2002
- IIRW 2002
The evolution of optical and electrical properties of low-k dielectrics under bias stress
- J.M. Atkin
- E. Cartier
- et al.
- 2009
- Microelectronic Engineering