Pb-free micro-joints (50 μm pitch) for the next generation micro-systems: The fabrication, assembly and characterization
- H. Gan
- S.L. Wright
- et al.
- 2006
- ECTC 2006
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36 results for Chirag S. Patel
A CMOS-compatible process for fabricating electrical through-vias in silicon
- P. Andry
- C. Tsang
- et al.
- 2006
- ECTC 2006
Silicon carrier for computer systems
- Chirag S. Patel
- 2006
- DAC 2006
Silicon carrier with deep through-vias, fine pitch wiring, and through cavity for parallel optical transceiver
- Chirag S. Patel
- Cornelia K. Tsang
- et al.
- 2005
- ECTC 2005
Terabus: Chip-to-chip board-level optical data buses
- J.A. Kash
- F.E. Doany
- et al.
- 2008
- LEOS 2008
300-Gb/s, 24-channel full-duplex, 850-nm, cmos-based optical transceivers
- C.L. Schow
- F.E. Doany
- et al.
- 2008
- OFC/NFOEC 2008
High-efficiency 60 GHz antenna fabricated using low-cost silicon micromachining techniques
- N. Hoivik
- D. Liu
- et al.
- 2007
- APS 2007
Silicon carrier with deep through-vias, fine pitch wiring, and through cavity for parallel optical transceiver
- Chirag S. Patel
- Cornelia K. Tsang
- et al.
- 2005
- ADMETA 2005
Chip-to-chip optical interconnects
- J.A. Kash
- F.E. Doany
- et al.
- 2006
- OFC/NFOEC 2006
Copper-filled through wafer vias with very low inductance
- Keith A. Jenkins
- Chirag S. Patel
- 2005
- IITC 2005