Characterization of flip chip microjoins up to 40 GHz using silicon carrier
- Chirag S. Patel
- Paul S. Andry
- et al.
- 2005
- IITC 2005
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36 results for Chirag S. Patel
Terabus: A chip-to-chip parallel optical interconnect
- J.A. Kash
- F.E. Doany
- et al.
- 2005
- LEOS 2005
Terabus: A Waveguide-Based Parallel Optical Interconnect
- F.E. Doany
- J.A. Kash
- et al.
- 2005
- FiO 2005
"Terabus" - A waveguide-based parallel optical interconnect for Tb/s-class on-board data transfers in computer systems
- L. Schares
- C.L. Schow
- et al.
- 2005
- ECOC 2005
Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology
- John U. Knickerbocker
- Chirag S. Patel
- et al.
- 2005
- CICC 2005
Optimal implementation of sea of leads (SoL) compliant interconnect technology
- Bing Dang
- Chirag Patel
- et al.
- 2004
- IITC 2004
3D chip-stacking technology with through-silicon vias and low-volume lead free interconnections
- Katsuyuki Sakuma
- Paul S. Andry
- et al.
- 2008
- IBM J. Res. Dev
Three-dimensional silicon integration
- John U. Knickerbocker
- Paul S. Andry
- et al.
- 2008
- IBM J. Res. Dev
3D chip stacking with C4 technology
- Bing Dang
- Steven L. Wright
- et al.
- 2008
- IBM J. Res. Dev
Terabus: Terabit/second-class card-level optical interconnect technologies
- Laurent Schares
- Jeffrey A. Kash
- et al.
- 2006
- IEEE Journal on Selected Topics in Quantum Electronics