Extendibility study of a PVD Cu seed process with Ar+ Rf-Plasma enhanced coverage for 45nm interconnects
- Andrew H. Simon
- Tibor Bolom
- et al.
- 2008
- MRS Spring Meeting 2008
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5 results for B. Rhoads
A SiCOH BEOL interconnect technology for high density and high performance 65 nm CMOS applications
- Matthew Angyal
- Jason Gill
- et al.
- 2005
- AMC 2005
90 nm SiCOH technology in 300 mm manufacturing
- L. Clevenger
- M. Yoon
- et al.
- 2004
- ADMETA 2004
New aqueous clean for aluminum interconnects: Part I. Fundamentals
- D.L. Rath
- R. Ravikumar
- et al.
- 2000
- Diffusion and Defect Data Pt.B: Solid State Phenomena
New aqueous clean for aluminum interconnects: Part II. Applications
- R. Ravikumar
- D.L. Rath
- et al.
- 2000
- Diffusion and Defect Data Pt.B: Solid State Phenomena