Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)
- Keiji Matsumoto
- Takahito Watanabe
- et al.
- 2022
- ECTC 2022
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29 results for Keiji Matsumoto
Study of design optimization method for ultra-low power micro gas sensor
- Eiji Nakamura
- Keiji Matsumoto
- et al.
- 2019
- ECTC 2019
Proposal of Package Structure Requirements for Effective Cooling from the Bottom Side of Chips (from the Substrate Side), Aiming for a Three-Dimensional (3D) Chip Stack
- Keiji Matsumoto
- Hiroyuki Mori
- 2016
- ECTC 2016
Embedded power insert enabling dual-side cooling of microprocessors
- Thomas Brunschwiler
- Dominic Gschwend
- et al.
- 2015
- ECTC 2015
Dual-side cooling for a three-dimensional (3D) chip stack : Additional cooling from the laminate (substrate) side
- Keiji Matsumoto
- Hiroyuki Mori
- et al.
- 2015
- ECTC 2015
IMC bonding for 3D interconnection
- Katsuyuki Sakuma
- Kuniaki Sueoka
- et al.
- 2010
- ECTC 2010
Thermal solution for Co-Packaged Optics (CPO) modules
- Keiji Matsumoto
- Mukta Farooq
- et al.
- 2022
- EDAPS 2022
An earbud-type wearable (A hearable) with vital parameter sensors for early detection and prevention of heat-stroke
- Keiji Matsumoto
- Yuksel Temiz
- et al.
- 2019
- EMBC 2019
A portable potentiometric electronic tongue leveraging smartphone and cloud platforms
- Patrick W. Ruch
- Rui Hu
- et al.
- 2019
- ISOEN 2019
Internet of the body and cognitive companion: Enabling high-quality monitoring of patients at home
- Rahel Straessle
- Yuksel Temiz
- et al.
- 2017
- Healthcom 2017