Scaling challenges of semiconductor packaging in the era of big data
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2013
- IMAPS 2013
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29 results for Keiji Matsumoto
High thermal conductive inter chip fill for 3D-IC through pre-applied joining process
- Y. Kawase
- M. Ikemoto
- et al.
- 2013
- IMAPS 2013
Scaling challenges of packaging in the Era of Big Data
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2013
- VLSI Technology 2013
Centrifugal formulation of percolating thermal underfills for flip-chip applications
- Jonas Zuercher
- Javier V. Goicochea
- et al.
- 2012
- CIPS 2012
Enhanced centrifugal percolating thermal underfills based on neck formation by capillary bridging
- Javier V. Goicochea
- Thomas Brunschwiler
- et al.
- 2012
- ITherm 2012
Formulation of percolating thermal underfill by sequential convective gap filling
- Thomas Brunschwiler
- Javier V. Goicochea
- et al.
- 2011
- ISHVAC 2011
Thermal resistance measurements of interconnections and modeling of thermal conduction path, for the investigation of the thermal resistance of a three-dimensional (3D) chip stack
- Keiji Matsumoto
- Yoichi Taira
- 2009
- ISCE 2009
Thermal resistance measurements of interconnections, for the investigation of the thermal resistance of a three-dimensional (3D) chip stack
- Keiji Matsumoto
- Yoichi Taira
- 2009
- SEMI-THERM 2009
Full intermetallic joints for chip stacking by using thermal gradient bonding
- T.L. Yang
- Toyohiro Aoki
- et al.
- 2016
- Acta Materialia