Hotspot-optimized interlayer cooling in vertically integrated packages
- 2008
- MRS Fall Meeting 2008
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13 results for U. Kloter
Radially oscillating flow hybrid cooling system for low profile electronics applications
- R. Wälchli
- R. Linderman
- et al.
- 2008
- SEMI-THERM 2008
Forced convective interlayer cooling in vertically integrated packages
- 2008
- ITherm 2008
Hierarchical nested surface channels for reduced particle stacking and low-resistance thermal interfaces
- R. Linderman
- T. Brunschwiler
- et al.
- 2007
- SEMI-THERM 2007
Direct liquid jet-impingement cooling with micronsized nozzle array and distributed return architecture
- Thomas Brunschwiler
- Hugo Rothuizen
- et al.
- 2006
- ITherm 2006
Microchip cooling module based on FC72 slot jet arrays without cross-flow
- M. Fabbri
- A. Wetter
- et al.
- 2006
- SEMI-THERM 2006
Hierarchically nested channels for fast squeezing interfaces with reduced thermal resistance
- T. Brunschwiler
- U. Kloter
- et al.
- 2005
- SEMI-THERM 2005
High-resolution patterning and transfer of thin PDMS films: FABRICATION of hybrid self-sealing 3D microfluidic systems
- U. Kloter
- H. Schmid
- et al.
- 2004
- MEMS 2004
High heat flux flow boiling in silicon multi-microchannels - Part II: Heat transfer characteristics of refrigerant R245fa
- Bruno Agostini
- John Richard Thome
- et al.
- 2008
- Int. J. Heat Mass Transf.
High heat flux flow boiling in silicon multi-microchannels - Part I: Heat transfer characteristics of refrigerant R236fa
- Bruno Agostini
- John Richard Thome
- et al.
- 2008
- Int. J. Heat Mass Transf.