Application of Cu Reflow Process on Ru Liner for Advanced Nanoscale Interconnects
- K. Motoyama
- O. van der Straten
- 2024
- ECS J. Solid State Sci. Technol.
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24 results for Koichi Motoyama
A novel integration scheme for self-aligend Ru topvia as post-Cu alternative metal interconnects
- K. Motoyama
- D. Metzler
- et al.
- 2023
- IITC/MAM 2023
Subtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect Scaling
- C. J. Penny
- Koichi Motoyama
- et al.
- 2022
- IEDM 2022
Metal-induced line width variability challenge and mitigation strategy in advanced post-Cu interconnects
- Koichi Motoyama
- Nicholas A. Lanzillo
- et al.
- 2022
- IITC 2022
EM performance improvements for Cu interconnects with Ru-based liner and Co cap in advanced nodes: (Invited)
- Koichi Motoyama
- 2021
- IITC 2021
Dual Damascene BEOL Extendibility With Cu Reflow / Selective TaN And Co/Cu Composite
- P. Bhosale
- N. Lanzillo
- et al.
- 2021
- VLSI Technology 2021
Exploring the Limits of Cobalt Liner Thickness in Advanced Copper Interconnects
- Nicholas A. Lanzillo
- Kisik Choi
- et al.
- 2019
- IEEE Electron Device Letters
Technology challenges and enablers to extend Cu metallization to beyond 7 nm node
- Takeshi Nogami
- H. Huang
- et al.
- 2019
- VLSI Technology 2019
An evaluation of Fuchs-Sondheimer and Mayadas-Shatzkes models below 14nm node wide lines
- R. S. Smith
- E. T. Ryan
- et al.
- 2019
- AIP Advances
Mechanisms of Electromigration Damage in Cu Interconnects
- C. K. Hu
- Lynne Gignac
- et al.
- 2018
- IEDM 2018