Packaging Issues and Solutions for Ultra-Low Power, High Efficiency GaN micro-LEDs for a Battery Free, Sub-mm2, Tetherless, Smart IoT System
- Frank R. Libsch
- S.W. Bedell
- et al.
- 2020
- IMAPS 2020
Publications
Date
Featured collections
Popular topics
44 results for Bucknell Webb
CMOS-Compatible Wearable Sensors Fabricated Using Controlled Spalling
- Katsuyuki Sakuma
- Huan Hu
- et al.
- 2019
- IEEE Sensors Journal
A wearable fingernail deformation sensing system and three-dimensional finite element model of fingertip
- Katsuyuki Sakuma
- Bucknell Webb
- et al.
- 2019
- ECTC 2019
Flexible Piezoresistive Sensors Fabricated by Spalling Technique
- Katsuyuki Sakuma
- Huan Hu
- et al.
- 2018
- IFETC 2018
Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 μm Pitch SnAg Solder 3-D Interconnections
- Katsuyuki Sakuma
- Bucknell Webb
- et al.
- 2016
- ECTC 2016
An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates
- Katsuyuki Sakuma
- Krishna Tunga
- et al.
- 2015
- ECTC 2015
Simulation of thermal pulse evolution during laser debonding
- Bucknell Webb
- Paul Andry
- 2015
- ECTC 2015
TSV/FET proximity study using dense addressable transistor arrays
- Raphael P. Robertazzi
- Kanak Agarwal
- et al.
- 2015
- IRPS 2015
Factors in the selection of temporary wafer handlers for 3D/2.5D integration
- Bing Dang
- Bucknell Webb
- et al.
- 2014
- ECTC 2014
Limits to on-chip power conversion with thin film inductors
- Philipp Herget
- Naigang Wang
- et al.
- 2013
- IEEE Transactions on Magnetics