A wearable fingernail deformation sensing system and three-dimensional finite element model of fingertip
- Katsuyuki Sakuma
- Bucknell Webb
- et al.
- 2019
- ECTC 2019
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44 results for Bucknell Webb
Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 μm Pitch SnAg Solder 3-D Interconnections
- Katsuyuki Sakuma
- Bucknell Webb
- et al.
- 2016
- ECTC 2016
An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates
- Katsuyuki Sakuma
- Krishna Tunga
- et al.
- 2015
- ECTC 2015
Simulation of thermal pulse evolution during laser debonding
- Bucknell Webb
- Paul Andry
- 2015
- ECTC 2015
Factors in the selection of temporary wafer handlers for 3D/2.5D integration
- Bing Dang
- Bucknell Webb
- et al.
- 2014
- ECTC 2014
Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks
- Zheng Xu
- Xiaoxiong Gu
- et al.
- 2012
- ECTC 2012
2.5D and 3D technology challenges and test vehicle demonstrations
- John Knickerbocker
- Paul Andry
- et al.
- 2012
- ECTC 2012
A 2.5D integrated voltage regulator using coupled-magnetic-core inductors on silicon interposer delivering 10.8A/mm 2
- Noah Sturcken
- Eugene O'Sullivan
- et al.
- 2012
- ISSCC 2012
Electromagnetic-SPICE modeling and analysis of 3D power network
- Zheng Xu
- Jian-Qiang Lu
- et al.
- 2011
- ECTC 2011
3D silicon integration
- J. Knickerbocker
- P. Andry
- et al.
- 2008
- ECTC 2008