Super Fine Jet Underfill Dispense Technique for Robust Micro Joint in Direct Bonded Heterogeneous Integration (DBHi) Silicon Bridge Packages
- Akihiro Horibe
- Chinami Marushima
- et al.
- 2022
- ECTC 2022
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3 results for Eric Turcotte
Chip package interaction evaluation for a high performance 65nm and 45nm CMOS technology in a stacked die package with C4 and wirebond interconnections
- Christopher Muzzy
- David Danovitch
- et al.
- 2008
- ECTC 2008
Multi-Wavelength Optical Transceivers Integrated on Node (MOTION)
- Daniel M. Kuchta
- Jonathan E. Proesel
- et al.
- 2019
- OFC 2019