T.N. Huynh, Anand Ramaswamy, et al.
Journal of Lightwave Technology
We report on efforts to develop a high speed, low cost, low energy chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Center applications.
T.N. Huynh, Anand Ramaswamy, et al.
Journal of Lightwave Technology
Jason S. Orcutt, Douglas M. Gill, et al.
OFC 2016
Benjamin G. Lee, Seongwon Kim, et al.
CLEO 2014
Pavlos Maniotis, Nicolas Dupuis, et al.
OECC/PSC 2022