Mechanisms of Electromigration Damage in Cu Interconnects
- C. K. Hu
- Lynne Gignac
- et al.
- 2018
- IEDM 2018
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48 results for Xiao Hu Liu
Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 μm Pitch SnAg Solder 3-D Interconnections
- Katsuyuki Sakuma
- Bucknell Webb
- et al.
- 2016
- ECTC 2016
Performance and reliability of thick Cu interconnects for RF and analog/mixed signal technology
- E. Cooney
- Jeff Gambino
- et al.
- 2013
- MRS Spring Meeting 2013
A 45 nm CMOS node Cu/low-k/ ULtra low-k PECVD SiCOH (k=2.4) BEOL technology
- S. Sankaran
- S. Arai
- et al.
- 2006
- IEDM 2006
High performance 45-nm SOI technology with enhanced strain, porous low-k BEOL, and immersion lithography
- S. Narasimha
- K. Onishi
- et al.
- 2006
- IEDM 2006
Single Crystal Flexible Electronics Enabled by 3D Spalling
- Ning Li
- Stephen W. Bedell
- et al.
- 2017
- Advanced Materials
High response piezoelectric and piezoresistive materials for fast, low voltage switching: Simulation and theory of transduction physics at the nanometer-scale
- Dennis M. Newns
- Bruce G. Elmegreen
- et al.
- 2012
- Advanced Materials
Evidence for electronic gap-driven metal-semiconductor transition in phase-change materials
- Dmitry Shakhvorostov
- Razvan A. Nistor
- et al.
- 2009
- PNAS
Tri-layer nanoindentation for mechanical characterization of ultra-low-k dielectrics
- Tingge Xu
- Yingjie Du
- et al.
- 2017
- IITC 2017
Impact of pattern collapse on future micro/nano fabrication
- Xiao Hu Liu
- 2017
- IITC 2017