Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- R. Filippi
- J.F. McGrath
- et al.
- 2004
- IRPS 2004
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48 results for Xiao Hu Liu
Modified edge lift-off test: Experimental modifications for multifilm systems
- J.C. Hay
- E. Liniger
- et al.
- 2000
- MRS Online Proceedings Library
CMOS-Compatible Wearable Sensors Fabricated Using Controlled Spalling
- Katsuyuki Sakuma
- Huan Hu
- et al.
- 2019
- IEEE Sensors Journal
A novel tri-layer nanoindentation method to measure the mechanical properties of a porous brittle ultra-low-k dielectric thin film
- Yingjie Du
- Tingge Xu
- et al.
- 2017
- Extreme Mechanics Letters
Creep characterization of solder bumps using nanoindentation
- Yingjie Du
- Xiao Hu Liu
- et al.
- 2016
- Mechanics of Time-Dependent Materials
Thin film wrinkling by strain mismatch on 3D surfaces
- Huan Hu
- Changjin Huang
- et al.
- 2016
- Extreme Mechanics Letters
Breakdown data generation and in-die deconvolution methodology to address BEOL and MOL dielectric breakdown challenges
- F. Chen
- Carole Graas
- et al.
- 2015
- Microelectronics Reliability
First realization of the piezoelectronic stress-based transduction device
- Josephine B. Chang
- Hiroyuki Miyazoe
- et al.
- 2015
- Nanotechnology
The piezoelectronic stress transduction switch for very large-scale integration, low voltage sensor computation, and radio frequency applications
- I.-B. Magdû
- Xiao Hu Liu
- et al.
- 2015
- Applied Physics Letters
Pathway to the Piezoelectronic Transduction Logic Device
- Paul Solomon
- Brian A. Bryce
- et al.
- 2015
- Nano Letters