Hybrid low dielectric constant thin films for microelectronics
- Willi Volksen
- Krystelle Lionti
- et al.
- 2014
- Scripta Materialia
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156 results for Willi Volksen
Independent control of adhesive and bulk properties of hybrid silica coatings on polycarbonate
- Krystelle Lionti
- Linying Cui
- et al.
- 2013
- ACS AMI
Investigation of plasma etch damage to porous oxycarbosilane ultra low-k dielectric
- Robert Bruce
- Sebastian Engelmann
- et al.
- 2013
- Journal of Physics D: Applied Physics
Impact of low-k structure and porosity on etch processes
- Maxime Darnon
- Nicolas Casiez
- et al.
- 2012
- Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics
Post Porosity Plasma Protection applied to a wide range of ultra low-k materials
- Theo Frot
- Willi Volksen
- et al.
- 2012
- IITC 2012
Post porosity plasma protection: Scaling of efficiency with porosity
- Theo Frot
- Willi Volksen
- et al.
- 2012
- Advanced Functional Materials
Integration of a manufacturing grade, k = 2.0 spin-on material in a single damascene structure
- Willi Volksen
- Sampath Purushothaman
- et al.
- 2012
- ECS J. Solid State Sci. Technol.
Planar collimated illumination system using nano-hybrid low index materials
- Yoichi Taira
- Hidetoshi Numata
- et al.
- 2011
- FiO 2011
Post Porosity Plasma Protection a new approach to integrate k 2.2 porous ULK materials
- Theo Frot
- Willi Volksen
- et al.
- 2011
- IITC/MAM 2011
Future of PECVD and spin-on ultra low-k materials
- Willi Volksen
- Theo Frot
- et al.
- 2011
- IITC/MAM 2011