Novel low k Dielectric materials for nano device interconnect technology
- Son Van Nguyen
- Hosadurga Shobha
- et al.
- 2020
- VLSI-TSA 2020
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119 results for Stephan A. Cohen
Electrical Properties of Chemical-Mechanical Polished Tetraethyl Orthosilicate Films with and Without Capping Layers
- S. Cohen
- M.A. Jaso
- et al.
- 2019
- JES
Short Time Annealing of Coevaporated Tungsten Silicide Films
- T.O. Sedgwick
- F.M. d'Heurle
- et al.
- 2019
- JES
Extreme-low k porous pSiCOH dielectrics prepared by PECVD
- H. You
- Petra Mennell
- et al.
- 2018
- JVSTB
Electromigration and resistivity in on-chip Cu, Co and Ru damascene nanowires
- C. K. Hu
- James Kelly
- et al.
- 2017
- IITC 2017
Low hydrogen silicon carbon nitride cap for high performance sub-10 nm Cu-low k interconnect
- Son Van Nguyen
- Shobha Hosadugra
- et al.
- 2017
- ECS Meeting 2017 - New Orleans
Low hydrogen silicon carbon nitride cap for high performance sub-10 nm Cu-low k interconnect
- Son Van Nguyen
- Shobha Hosadugra
- et al.
- 2017
- ECS J. Solid State Sci. Technol.
Advanced single precursor based pSiCOH k = 2.4 for ULSI interconnects
- Deepika Priyadarshini
- Son Van Nguyen
- et al.
- 2017
- JVSTB
Triangular Voltage Sweep (TVS) characterisation for Through-Silicon-Via (TSV) reliability
- C. Kothandaraman
- Stephan A. Cohen
- 2016
- IRPS 2016
Effect of H2O on TDDB for a range of ULK ILD materials with varying damage resistance for robust and weak liners
- Eric G. Liniger
- Robert B. Laibowitz
- et al.
- 2016
- IRPS 2016