Stress determination through diffraction: Establishing the link between Kröner and Voigt/Reuss limits
- Conal E. Murray
- Jean L. Jordan-Sweet
- et al.
- 2015
- Powder Diffraction
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34 results for E. T. Ryan
Effect of low-frequency radio frequency on plasma-enhanced chemical vapor deposited ultra low-κ dielectric films for very large-scale integrated interconnects
- E. T. Todd Ryan
- Stephen M. Gates
- et al.
- 2014
- Journal of Applied Physics
Weighted mechanical models for residual stress determination using x-ray diffraction
- Conal E. Murray
- Stephen W. Bedell
- et al.
- 2013
- Journal of Applied Physics
Mitigating residual stress in Cu metallization
- Conal E. Murray
- Jean Jordan-Sweet
- et al.
- 2012
- Applied Physics Letters
Understanding stress gradients in microelectronic metallization
- Conal E. Murray
- E. Todd Ryan
- et al.
- 2012
- Powder Diffraction
Effective Cu surface pre-treatment for high-reliable 22 nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k = 2.2)
- F. Ito
- H. Shobha
- et al.
- 2012
- Microelectronic Engineering
Evolution of stress gradients in Cu films and features induced by capping layers
- Conal E. Murray
- E.T. Ryan
- et al.
- 2012
- Microelectronic Engineering
Competitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies
- R. Augur
- C. Child
- et al.
- 2012
- Microelectronic Engineering
Manipulating stress in Cu/low-k dielectric nanocomposites
- Conal E. Murray
- Paul R. Besser
- et al.
- 2011
- Applied Physics Letters
Triaxial stress distributions in Cu/low-k interconnect features
- Conal E. Murray
- Paul R. Besser
- et al.
- 2011
- Applied Physics Letters