Differential inhibition during Cu electrodeposition on Ru: Combined electrochemical and real-time TEM studies
- P. M. Vereecken
- Alex Radisic
- et al.
- 2018
- JES
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20 results for P. M. Vereecken
Growth of carbon nanotube branches by electrochemical decoration of carbon nanotubes
- Claudia A. Santini
- Philippe M. Vereecken
- et al.
- 2012
- Materials Letters
Stress in electrodeposited high moment CoFe films
- I. Shao
- L. Romankiw
- et al.
- 2009
- ECS Meeting 2009
Etching of copper in deionized water rinse
- J.P. Gambino
- J. Robbins
- et al.
- 2008
- IPFA 2008
Effect of additives on shape evolution during electrodeposition: III. Trench infill for on-chip interconnects
- Yan Qin
- Xiaohai Li
- et al.
- 2008
- JES
Effect of additives on shape evolution during electrodeposition
- Effendi Rusli
- Feng Xue
- et al.
- 2007
- JES
The morphology and nucleation kinetics of copper islands during electrodeposition
- A. Radisic
- P.M. Vereecken
- et al.
- 2006
- Surface Science
Underlayer effects on texture evolution in copper films
- C.E. Murray
- K.P. Rodbell
- et al.
- 2006
- Thin Solid Films
Electrochemical characterization of adsorption-desorption of the cuprous-suppressor-chloride complex during electrodeposition of copper
- John G. Long
- Peter C. Searson
- et al.
- 2006
- JES
Quantifying electrochemical nucleation and growth of nanoscale clusters using real-time kinetic data
- Aleksandar Radisic
- Philippe M. Vereecken
- et al.
- 2006
- Nano Letters