Dynamic microscopy of nanoscale cluster growth at the solid-liquid interface
- M.J. Williamson
- R.M. Tromp
- et al.
- 2003
- Nature Materials
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20 results for P. M. Vereecken
Stress in electrodeposited high moment CoFe films
- I. Shao
- L. Romankiw
- et al.
- 2009
- ECS Meeting 2009
Etching of copper in deionized water rinse
- J.P. Gambino
- J. Robbins
- et al.
- 2008
- IPFA 2008
Uniform copper electroplating on resistive substrates
- Rui Fang
- Keisuke Namiki
- et al.
- 2004
- ECS Meeting 2004
Integration of direct plating of Cu onto a CVD Ru liner
- S. Malhotra
- D. Canaperi
- et al.
- 2004
- AMC 2004
In situ transmission electron microscopy of copper electrodeposition
- Frances M. Ross
- Mark J. Williamson
- et al.
- 2002
- Microscopy and Microanalysis
Differential inhibition during Cu electrodeposition on Ru: Combined electrochemical and real-time TEM studies
- P. M. Vereecken
- Alex Radisic
- et al.
- 2018
- JES
Growth of carbon nanotube branches by electrochemical decoration of carbon nanotubes
- Claudia A. Santini
- Philippe M. Vereecken
- et al.
- 2012
- Materials Letters
Effect of additives on shape evolution during electrodeposition: III. Trench infill for on-chip interconnects
- Yan Qin
- Xiaohai Li
- et al.
- 2008
- JES
Effect of additives on shape evolution during electrodeposition
- Effendi Rusli
- Feng Xue
- et al.
- 2007
- JES