Evaluation of different metal preclean conditions for MOL for 2nm and beyond: Topic/category: AEPM : nt Processes and Materials
- Samuel Munnangi
- Andrew Simon
- et al.
- 2024
- ASMC 2024
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62 results for Andrew Simon
Etching of iridium thin films in chlorine- and fluorine-based inductively coupled plasmas
- Juliano Borges
- Hongwen Yan
- et al.
- 2024
- SPIE Advanced Lithography 2024
Optimization of Projected Phase Change Memory for Analog In-Memory Computing Inference
- Ning Li
- Charles Mackin
- et al.
- 2023
- Advanced Materials
Impact of Phase-Change Memory Drift on Energy Efficiency and Accuracy of Analog Compute-in-Memory Deep Learning Inference (Invited)
- Martin M. Frank
- Ning Li
- et al.
- 2023
- IRPS 2023
Subtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect Scaling
- C. J. Penny
- Koichi Motoyama
- et al.
- 2022
- IEDM 2022
Design of projected phase-change memory mushroom cells for low-resistance drift
- Timothy M. Philip
- Kevin W. Brew
- et al.
- 2022
- MRS Bulletin
Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects
- Takeshi Nogami
- Oleg Gluschenkov
- et al.
- 2022
- VLSI Technology and Circuits 2022
Impact of Nanosecond Laser Anneal on PVD Ru Films
- D. Sil
- Yasir Sulehria
- et al.
- 2021
- IITC 2021
Dual Damascene BEOL Extendibility With Cu Reflow / Selective TaN And Co/Cu Composite
- P. Bhosale
- N. Lanzillo
- et al.
- 2021
- VLSI Technology 2021
Role of high aspect-ratio thin-film metal deposition in Cu back-end-of-line technology
- Andrew Simon
- O. Van Der Straten
- et al.
- 2020
- JVSTA