IMS (injection molded solder) technology with liquid photoresist for ultra fine pitch bumping
- Toyohiro Aoki
- Kazushige Toriyama
- et al.
- 2014
- IMAPS 2014
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32 results for Toyohiro Aoki
Characterization of micro bump formed by Injection Molded Solder (IMS) technology
- Toyohiro Aoki
- Kazushige Toriyama
- et al.
- 2014
- ICEP 2014
Low power CMOS-driven 1060 nm multimode optical link
- Jean Benoit Héroux
- Tomofumi Kise
- et al.
- 2014
- OFC 2014
Scaling challenges of semiconductor packaging in the era of big data
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2013
- IMAPS 2013
Chip-to-Package Interaction for a 90 nm Cu / PECVD Low-k technology
- W. Landers
- D. Edelstein
- et al.
- 2004
- IITC 2004
Simulation and Experimental study on IMS (Injection Molded Solder) bumping with expanded resist patterning for reinforcement of fine-pitch capability
- Risa Miyazawa
- Eiji Nakamura
- et al.
- 2021
- Advancing Microelectronics
Characterization of sintered Cu nanopaste for micro-bumping with Injection Molded Solder technology
- Eiji Nakamura
- Toyohiro Aoki
- et al.
- 2021
- Advancing Microelectronics
Development of liquid photoresist for IMS (Injection molded solder) with high thermal stability
- Jun Mukawa
- Seiichirou Takahashi
- et al.
- 2016
- J. Photopolym. Sci. Tech.
Development and commercialization of solder bump fabrication technology with molten solder injection method
- Toyohiro Aoki
- Kazushige Toriyama
- et al.
- 2015
- J. Jpn. Inst. Electron. Packag.
Full intermetallic joints for chip stacking by using thermal gradient bonding
- T.L. Yang
- Toyohiro Aoki
- et al.
- 2016
- Acta Materialia