Super Fine Jet Underfill Dispense Technique for Robust Micro Joint in Direct Bonded Heterogeneous Integration (DBHi) Silicon Bridge Packages
- Akihiro Horibe
- Chinami Marushima
- et al.
- 2022
- ECTC 2022
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10 results for Chinami Marushima
Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package
- Chinami Marushima
- Toyohiro Aoki
- et al.
- 2022
- ECTC 2022
Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2022
- ECTC 2022
Plating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining
- Toyohiro Aoki
- Eiji Nakamura
- et al.
- 2020
- ECTC 2020
Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method
- Sayuri Kohara
- Toyohiro Aoki
- et al.
- 2022
- ITherm 2022
Thermomechanical Analysis on Stress Mitigation of FCPBGA with Low Melting Temperature Solder and Low Elastic Modulus Cu Pillar
- Takashi Hisada
- Sayuri Kohara
- et al.
- 2022
- ICEP 2022
Surface Silicon Bridge Direct Bonded Heterogeneous Integration (s-DBHi)
- Kamal Sikka
- Isabel De Sousa
- et al.
- 2022
- EDTM 2022
Morphology and Mechanical property of Cu pillar formed by sintered Cu nanoparticles for the plating-free bumping process
- Chinami Marushima
- Toyohiro Aoki
- et al.
- 2021
- ICEP 2021
Simulation and Experimental study on IMS (Injection Molded Solder) bumping with expanded resist patterning for reinforcement of fine-pitch capability
- Risa Miyazawa
- Eiji Nakamura
- et al.
- 2021
- Advancing Microelectronics
Characterization of sintered Cu nanopaste for micro-bumping with Injection Molded Solder technology
- Eiji Nakamura
- Toyohiro Aoki
- et al.
- 2021
- Advancing Microelectronics