Publications

24 results for Takashi Hisada

Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip
- - Toyohiro Aoki
  - Katsuyuki Sakuma
  - et al.
- 2023
- ECTC 2023
Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
- - Qianwen Chen
  - Michael Belyansky
  - et al.
- 2023
- ECTC 2023
CFD Simulation Analysis of Inter/Intra Chip Liquid Cooling for 3D Stacked ICs
- - Risa Miyazawa
  - Hiroyuki Mori
  - et al.
- 2023
- iTHERM 2023
Flip Chip Joining with Injection Molded Solder Technology
- - Takashi Hisada
  - Toyohiro Aoki
- 2023
- EDTM 2023
Super Fine Jet Underfill Dispense Technique for Robust Micro Joint in Direct Bonded Heterogeneous Integration (DBHi) Silicon Bridge Packages
- - Akihiro Horibe
  - Chinami Marushima
  - et al.
- 2022
- ECTC 2022
Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package
- - Chinami Marushima
  - Toyohiro Aoki
  - et al.
- 2022
- ECTC 2022
Thermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process
- - Prabudhya Roy Chowdhury
  - Katsuyuki Sakuma
  - et al.
- 2022
- ECTC 2022
Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method
- - Sayuri Kohara
  - Toyohiro Aoki
  - et al.
- 2022
- ITherm 2022
Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)
- - Keiji Matsumoto
  - Takahito Watanabe
  - et al.
- 2022
- ECTC 2022
Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package
- - Akihiro Horibe
  - Takahito Watanabe
  - et al.
- 2022
- ECTC 2022