Effects of solder wettability of resist materials on solder filling with Injection Molded Solder (IMS) technology
- Toyohiro Aoki
- Takashi Hisada
- et al.
- 2016
- ICEP 2016
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24 results for Takashi Hisada
Simulation and Experimental study on IMS (Injection Molded Solder) bumping with expanded resist patterning for reinforcement of fine-pitch capability
- Risa Miyazawa
- Eiji Nakamura
- et al.
- 2021
- Advancing Microelectronics
Characterization of sintered Cu nanopaste for micro-bumping with Injection Molded Solder technology
- Eiji Nakamura
- Toyohiro Aoki
- et al.
- 2021
- Advancing Microelectronics
Development of liquid photoresist for IMS (Injection molded solder) with high thermal stability
- Jun Mukawa
- Seiichirou Takahashi
- et al.
- 2016
- J. Photopolym. Sci. Tech.