Understanding mobility mechanisms in extremely scaled HfO2 (EOT 0.42 nm) using remote interfacial layer scavenging technique and V t-tuning dipoles with gate-first processT. AndoM.M. Franket al.2009IEDM 2009
High-κ/metal gate low power bulk technology - Performance evaluation of standard CMOS logic circuits, microprocessor critical path replicas, and SRAM for 45nm and beyondD.-G. ParkK. Steinet al.2009VLSI-TSA 2009
Interaction of La2O3 capping layers with HfO 2 gate dielectricsM. CopelS. Guhaet al.2009Applied Physics Letters
Extremely scaled gate-first high-k/metal gate stack with EOT of 0.55 nm using novel interfacial layer scavenging techniques for 22nm technology node and beyondK. ChoiH. Jagannathanet al.2009VLSI Technology 2009
pFET V t control with HfO 2/TiN/poly-Si gate stack using a lateral oxygenation processB. CartierM. Steenet al.2009VLSI Technology 2009
Scaling the MOSFET gate dielectric: From high-k to higher-k? (Invited Paper)Martin M. FrankSangBum Kimet al.2009Microelectronic Engineering
Quasi-damascene metal gate/high-k CMOS using oxygenation through gate electrodesChanghwan ChoiTakashi Andoet al.2009Microelectronic Engineering
Interfacial layer optimization of high-k/metal gate stacks for low temperature processingBarry P. LinderVijay Narayananet al.2009Microelectronic Engineering
Engineering band-edge high-κ/metal gate n-MOSFETs with cap layers containing group IIA and IIIB elements by atomic layer depositionH. JagannathanL.F. Edgeet al.2009ECS Meeting 2009