A novel integration scheme for self-aligend Ru topvia as post-Cu alternative metal interconnects
- K. Motoyama
- D. Metzler
- et al.
- 2023
- IITC/MAM 2023
Publications
Date
Featured collections
Popular topics
60 results for Nick Lanzillo
Methodology Development to Benchmark Power Delivery Designs in Advanced Technology Nodes
- Nicholas A. Lanzillo
- A. Chu
- et al.
- 2023
- SPIE Advanced Lithography + Patterning 2023
Capacitive Impacts of Etch-Induced Dielectric Damage in Highly-Scaled Interconnect Architectures
- Janet M. Wilson
- Nicholas A. Lanzillo
- 2022
- IITC 2022
Metal-induced line width variability challenge and mitigation strategy in advanced post-Cu interconnects
- Koichi Motoyama
- Nicholas A. Lanzillo
- et al.
- 2022
- IITC 2022
Dual Damascene BEOL Extendibility With Cu Reflow / Selective TaN And Co/Cu Composite
- P. Bhosale
- N. Lanzillo
- et al.
- 2021
- VLSI Technology 2021
Comprehensive BEOL Performance Assessment: Interconnects Optimized for Signal Routing and Power Delivery in Advanced CMOS Technology Nodes (Invited)
- Nicholas A. Lanzillo
- Rwik Sengupta
- et al.
- 2020
- IITC 2020
Composite Interconnects for High-Performance Computing beyond the 7nm Node
- P. Bhosale
- S. Parikh
- et al.
- 2020
- VLSI Technology 2020
A Materials Screening Methodology for Scaled Non-Volatile Memory in the AI Era
- Nicholas A. Lanzillo
- R. R. Robison
- 2019
- ANTS 2019
Technology challenges and enablers to extend Cu metallization to beyond 7 nm node
- Takeshi Nogami
- H. Huang
- et al.
- 2019
- VLSI Technology 2019
Impact of Line and Via Resistance on Device Performance at the 5nm Gate All Around Node and beyond
- Nicholas A. Lanzillo
- Koichi Motoyama
- et al.
- 2018
- IITC 2018