Publications

146 results for Daniel Edelstein

Thermal stress control in Cu interconnects
- - Chih-Chao Yang
  - Baozhen Li
  - et al.
- 2014
- IITC/AMC 2014
Ultrathin (8-14 nm) conformal SiN for sub-20 nm Copper/Low-k Interconnects
- - Son Van Nguyen
  - Deepika Priyadarshini
  - et al.
- 2014
- ECS Meeting 2014
Microstructure modulation in copper interconnects
- - Chih-Chao Yang
  - Baozhen Li
  - et al.
- 2014
- IEEE Electron Device Letters
CVD-Co/Cu(Mn) integration and reliability for 10 nm node
- - Takeshi Nogami
  - M. He
  - et al.
- 2013
- IITC 2013
Electrodeposited Cu film morphology on thin PVD Cu seed layers
- - James Kelly
  - X. Lin
  - et al.
- 2013
- JES
Perspectives into CVD-cobalt liner induced increase in resistivity of Cu interconnect
- - Wei Lin
  - Xunyuan Zhang
  - et al.
- 2013
- ADMETA 2013
Electrical properties and reliability of ALD TaN barrier for sub-90nmPitch Cu interconnects
- - Tibor Bolom
  - J. Lee
  - et al.
- 2013
- ADMETA 2013
Temperature and field interrelation study of low-k TDDB for Cu interconnects with and without liner - New insights to the roles of Cu for a competing breakdown process
- - Fen Chen
  - Michael Shinosky
  - et al.
- 2013
- IRPS 2013
Mechanism of co liner as enhancement layer for Cu interconnect gap-fill
- - M. He
  - X. Zhang
  - et al.
- 2013
- JES
Dependence of Cu electromigration resistance on selectively deposited CVD Co cap thickness
- - C.-C. Yang
  - F. Baumann
  - et al.
- 2013
- Microelectronic Engineering