Publications

146 results for Daniel Edelstein

Materials and scaling effects on on-chip interconnect reliability
- - C.-K. Hu
  - E. Liniger
  - et al.
- 2013
- MRS Spring Meeting 2013
Electrodeposited Cu film morphology on thin PVD Cu seed layers
- - James J. Kelly
  - X. Lin
  - et al.
- 2013
- ECS Transactions
X-ray characterization of PEALD versus PVD tantalum nitride barrier deposition and the impact on via contact resistance
- - Xunyuan Zhang
  - Oscar Van der Straten
  - et al.
- 2013
- ECS Transactions
Invasion percolation model for abnormal time-dependent dielectric breakdown characteristic of low-k dielectrics due to massive metallic diffusion
- - Fen Chen
  - Michael Shinosky
  - et al.
- 2012
- Applied Physics Letters
Electromigration extendibility of Cu(Mn) alloy-seed interconnects, and understanding the fundamentals
- - Takeshi Nogami
  - C. Penny
  - et al.
- 2012
- IEDM 2012
Experimental confirmation of electron fluence driven, Cu catalyzed interface breakdown model for low-k TDDB
- - Fen Chen
  - Jeffrey Gambino
  - et al.
- 2012
- IRPS 2012
In-situ metal/dielectric capping process for electromigration enhancement in Cu interconnects
- - Chih-Chao Yang
  - Fen Chen
  - et al.
- 2012
- IITC 2012
Effects of metal capping on thermal annealing of copper interconnects
- - Chih-Chao Yang
  - B. Li
  - et al.
- 2012
- IEEE Electron Device Letters
Electromigration in Cu(Al) and Cu(Mn) damascene lines
- - C.-K. Hu
  - J. Ohm
  - et al.
- 2012
- Journal of Applied Physics
Competitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies
- - R. Augur
  - C. Child
  - et al.
- 2012
- Microelectronic Engineering