Mitigating TSV-induced substrate noise coupling in 3-D IC using buried interface contacts
- Xiaoxiong Gu
- Joel Silberman
- et al.
- 2012
- EPEPS 2012
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93 results for Xiaoxiong Gu
Validation and application of physics-based via models to dense via arrays
- Xiaoxiong Gu
- Young Kwark
- et al.
- 2011
- DesignCon 2011
Impact of multiple scattering on passivity of equivalent-circuit via models
- Xiaomin Duan
- Renato Rimolo-Donadio
- et al.
- 2011
- EDAPS 2011
High-density silicon carrier transmission line design for chip-to-chip interconnects
- Xiaoxiong Gu
- Lavanya Turlapati
- et al.
- 2011
- EPEPS 2011
Parametric study on the effect of asymmetry in multi-channel differential signaling
- Ki Jin Han
- Xiaoxiong Gu
- et al.
- 2011
- EMC 2011
An 8x10-Gb/s source-synchronous I/O system based on high-density silicon carrier interconnects
- Timothy O. Dickson
- Yong Liu
- et al.
- 2011
- VLSI Circuits 2011
Novel multiport probing fixture for high frequency measurements in dense via arrays
- Young H. Kwark
- Miroslav Kotzev
- et al.
- 2011
- IMS 2011
Electrical performance of a multiport interposer for measurements of dense via arrays
- Miroslav Kotzev
- Young H. Kwark
- et al.
- 2011
- IEEE-SPI 2011
Parasitics extraction, wideband modeling and sensitivity analysis of through-strata-via (TSV) in 3D integration/packaging
- Zheng Xu
- Xiaoxiong Gu
- et al.
- 2011
- ASMC 2011
Fast physics-based via and trace models for signal and power integrity co-analysis
- Xiaoxiong Gu
- Renato Rimolo-Donadio
- et al.
- 2010
- DesignCon 2010