Reliability challenges with ultra-low k interlevel dielectrics
- J.R. Lloyd
- M. Lane
- et al.
- 2004
- Microelectronics Reliability
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148 results for Thomas M. Shaw
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- R. Filippi
- J.F. McGrath
- et al.
- 2004
- IRPS 2004
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- R. Filippi
- J.F. McGrath
- et al.
- 2004
- IRPS 2004
Moisture and oxygen uptake in Low K/ copper interconnect structures
- T.M. Shaw
- D. Jimerson
- et al.
- 2003
- ADMETA 2003
The effect of forming gas annealing on Pt/(Ba,Sr)TiO3/Pt thin film capacitors for future dram applications: Electrical properties and degradation mechanisms
- J.D. Baniecki
- C. Parks
- et al.
- 2001
- MRS Online Proceedings Library
Bottom electrode effects in controlling orientation of lead zirconate titanate films deposited by chemical solution deposition
- Deborah A. Neumayer
- Katherine L. Saenger
- et al.
- 1999
- MRS Proceedings 1999
Low temperature hydrogen induced degradation of (Ba,Sr)TiO3 thin film capacitors
- J.D. Baniecki
- C. Parks
- et al.
- 1999
- MRS Proceedings 1999
A high performance 0.13 μm copper BEOL technology with low-k dielectric
- R.D. Goldblatt
- B.N. Agarwala
- et al.
- 2000
- IITC 2000