Giant piezoresistive On/Off ratios in rare-earth chalcogenide thin films enabling nanomechanical switching
- Matthew Copel
- Marcelo A. Kuroda
- et al.
- 2013
- Nano Letters
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148 results for Thomas M. Shaw
Delayed mechanical failure of the under-bump interconnects by bump shearing
- Han Li
- Thomas M. Shaw
- et al.
- 2012
- Journal of Applied Physics
Processing and moisture effects on TDDB for Cu/ULK BEOL structures
- E. Liniger
- T.M. Shaw
- et al.
- 2012
- Microelectronic Engineering
Competitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies
- R. Augur
- C. Child
- et al.
- 2012
- Microelectronic Engineering
The effect of grain size on microstructure and stress relaxation in polycrystalline Y1Ba2Cu3O7-δ
- T.M. Shaw
- S. Shinde
- et al.
- 2011
- Journal of Materials Research
Carbon Retention in YBa2Cu3O7−δ its Effect On The Superconducting Transition
- T.M. Shaw
- D. Dimos
- et al.
- 2011
- Journal of Materials Research
Effects of contact area on mechanical strength, electrical resistance, and electromigration reliability of Cu/Low- k interconnects
- C.-C. Yang
- T.M. Shaw
- et al.
- 2010
- Electrochemical and Solid-State Letters
The evolution of optical and electrical properties of low-k dielectrics under bias stress
- J.M. Atkin
- E. Cartier
- et al.
- 2009
- Microelectronic Engineering
Charge trapping at the low- k dielectric-silicon interface probed by the conductance and capacitance techniques
- J.M. Atkin
- E. Cartier
- et al.
- 2008
- Applied Physics Letters
Photocurrent spectroscopy of low- k dielectric materials: Barrier heights and trap densities
- J.M. Atkin
- D. Song
- et al.
- 2008
- Journal of Applied Physics