Thermally Conductive Composite Material with Percolating Microparticles Applied as Underfill
- Rahel Straessle
- Severin Zimmermann
- et al.
- 2018
- IEEE Transactions on CPMT
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20 results for Severin Zimmermann
Enhanced percolating thermal underfills achieved by means of nanoparticle bridging necks
- Jonas Zürcher
- Xi Chen
- et al.
- 2016
- IEEE Transactions on CPMT
Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
- Thomas Brunschwiler
- Jonas Zürcher
- et al.
- 2016
- ASME Journal of Electronic Packaging
A high-efficiency hybrid high-concentration photovoltaic system
- Severin Zimmermann
- Henning Helmers
- et al.
- 2015
- Int. J. Heat Mass Transf.
Energy efficient hotspot-targeted embedded liquid cooling of electronics
- Chander Shekhar Sharma
- Manish K. Tiwari
- et al.
- 2015
- Applied Energy
In situ assembly in confined spaces of coated particle scaffolds as thermal underfills with extraordinary thermal conductivity
- Guo Hong
- Thomas M. Schutzius
- et al.
- 2014
- ACS AMI
Hot water cooled electronics: Exergy analysis and waste heat reuse feasibility
- Severin Zimmermann
- Manish K. Tiwari
- et al.
- 2012
- Int. J. Heat Mass Transf.
Aquasar: A hot water cooled data center with direct energy reuse
- Severin Zimmermann
- Ingmar Meijer
- et al.
- 2012
- Energy
Compact thermal model for the transient temperature prediction of a water-cooled microchip module in low carbon emission computing
- A. Kubilay
- S. Zimmermann
- et al.
- 2011
- Numerical Heat Transfer; Part A: Applications
Hot water cooled heat sinks for efficient data center cooling: Towards electronic cooling with high exergetic utility
- Peter Kasten
- Severin Zimmermann
- et al.
- 2010
- Frontiers in Heat and Mass Transfer