Pulsed Potentiostatic Deposition of Gold from Solutions of the Au(I) Sulfite Complex
- Jean Horkans
- L. Romankiw
- 2019
- JES
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94 results for Lubomyr T. Romankiw
Plating of Copper into Through-Holes and Vias
- Richard C. Alkire
- Lubomyr T. Romankiw
- 2019
- JES
Stripping Voltammetry of Nickel-Iron Films Electrodeposited on Platinum Using a Rotating Ring-Disk Electrode
- J. Tabib
- L. Romankiw
- 2019
- JES
Electrodeposition of Nickel-Iron Alloys: 1. Effect of Agitation
- P.C. Andricacos
- C. Arana
- et al.
- 2019
- JES
A TEM Study of the Effect of Accelerators on Pd-Sn Colloidal Catalysts and on the Initiation of Electroless Cu Deposition on Epoxy
- Jean Horkans
- Jungihl Kim
- et al.
- 2019
- JES
Correlation of Structure and Magnetic Properties of Thin CoP Films
- J. Mahlke
- N.C. Anderson
- et al.
- 2019
- JES
Jet and Laser-Jet Electrochemical Micromachining of Nickel and Steel
- M. Datta
- L. Romankiw
- et al.
- 2019
- JES
Fundamental Study of Acid Copper Through-Hole Electroplating Process
- Edward K. Yung
- Lubomyr T. Romankiw
- 2019
- JES
Application of Chemical and Electrochemical Micromachining in the Electronics Industry
- Madhav Datta
- Lubomyr T. Romankiw
- 2019
- JES
Maskless Laser Patterning for Gold Plating of Microelectronic Materials
- R.J. von Gutfeld
- M.H. Gelchinski
- et al.
- 2019
- JES