Embedded power insert enabling dual-side cooling of microprocessors
- Thomas Brunschwiler
- Dominic Gschwend
- et al.
- 2015
- ECTC 2015
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12 results for Stefano Oggioni
Investigation of novel solder patterns for power delivery and heat removal support
- Thomas Brunschwiler
- Yassir Madhour
- et al.
- 2013
- ECTC 2013
120 Gb/s optical card-to-card interconnect link demonstrator with embedded waveguides
- L. Dellmann
- C. Berger
- et al.
- 2007
- ECTC 2007
Thermal power plane enabling dual-side electrical interconnects for high-performance chip stacks: Concept
- Thomas Brunschwiler
- Ralph Heller
- et al.
- 2014
- ESTC 2014
Thermal power plane enabling dual-side electrical interconnects for high-performance chip stacks: Implementation
- Thomas Brunschwiler
- Timo Tick
- et al.
- 2014
- ESTC 2014
Laminate with thermal - Power insert for efficient front-side heat removal and power delivery
- Dominic Gschwend
- Timo Tick
- et al.
- 2014
- CIPS 2014
Integration of optical I/O with organic chip packages
- Bert J. Offrein
- Christoph Bergen
- et al.
- 2008
- SPIE Photonics Europe 2008
Integration of optical I/O with organic chip packages
- Christoph Berger
- Laurent Dellmann
- et al.
- 2008
- SPIE IOPTO 2008
Butt-coupled optoelectronic modules for high-speed optical interconnects
- L. Dellmann
- T. Lamprecht
- et al.
- 2005
- CLEO/Europe 2005
Optical Transceiver Module for 1.2 Tb/s Based on Flexible Circuit Technology
- Jonas Weiss
- Daniel Jubin
- et al.
- 2017
- IEEE Transactions on CPMT