Polymer-waveguide-based board-level optical interconnect technology for datacom applications
- Roger Dangel
- Christoph Berger
- et al.
- 2008
- IEEE Transactions on Advanced Packaging
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12 results for Stefano Oggioni
The evolution of build-up package technology and its design challenges
- Edmund D. Blackshear
- Moises Cases
- et al.
- 2005
- IBM J. Res. Dev