The projection of the incidence of dielectric cracking during chip joining with lead free solder bumps
- Thomas M. Shaw
- Xiao Hu Liu
- et al.
- 2016
- IRPS 2016
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10 results for D. Kioussis
The strength of BEOL structures fabricated using low K materials and its impact on CPI failures
- Thomas M. Shaw
- Xiao Hu Liu
- et al.
- 2015
- IIRW 2015
Experimental confirmation of electron fluence driven, Cu catalyzed interface breakdown model for low-k TDDB
- Fen Chen
- Jeffrey Gambino
- et al.
- 2012
- IRPS 2012
Designing porous ultra low-κ dielectrics to meet scaling challenges
- E. Todd Ryan
- Steve Gates
- et al.
- 2011
- ADMETA 2011
Optimization of porous ultra low- dielectrics (κ≤ 2.55) for 28nm generation
- D. Kioussis
- E.T. Ryan
- et al.
- 2011
- IITC/MAM 2011
Competitive and cost effective copper/low-k interconnect (BEOL) for 28nm CMOS technologies
- Rod Augur
- Craig Child
- et al.
- 2010
- ADMETA 2010
UV curing-induced photoresist poisoning in advanced ULK BEOL integration schemes
- Y.C. Ee
- D. Kioussis
- et al.
- 2009
- ADMETA 2009
Evaluation of barrier CMP slurries and characterization of ULK material properties shifts due to CMP
- Wei-Tsu Tseng
- Dimitri Kioussis
- et al.
- 2008
- ECS Meeting 2008
Optimized interfacial strength for dense and porous SiCOH
- D.D. Restaino
- Steve Molis
- et al.
- 2007
- ADMETA 2007
Competitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies
- R. Augur
- C. Child
- et al.
- 2012
- Microelectronic Engineering