Bimodal electromigration mechanisms in dual-damascene Cu line/via on W
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- IITC 2002
Publications
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61 results for Robert Rosenberg
Scaling effect on electromigration in on-chip Cu wiring
- C.-K. Hu
- R. Rosenberg
- et al.
- 1999
- IITC 1999
Electromigration damage in aluminum film conductors
- M.J. Attardo
- R. Rosenberg
- 1970
- IRPS 1970
Stress relaxation in Cu thin films
- C. Witt
- R. Rosenberg
- et al.
- 2008
- International Workshop on Stress-Induced Phenomena in Metallization 2008
Evolution of strain energy during recrystallization of plated Cu films
- Conal E. Murray
- Mikhail Treger
- et al.
- 2016
- IEEE T-DMR
Prediction of recrystallization times in electroplated copper thin films
- Mikhail Treger
- C. Witt
- et al.
- 2016
- Thin Solid Films
Detection of charge carrier confinement into mobile ionic defects in nanoporous dielectric films for advanced interconnects
- Juan Borja
- Joel L. Plawsky
- et al.
- 2014
- JVSTA
Electromigration kinetics and critical current of Pb-free interconnects
- Minhua Lu
- Robert Rosenberg
- 2014
- Applied Physics Letters
Room temperature interaction in bimetallic thin film couples
- King-Ning Tu
- Robert Rosenberg
- 2014
- Japanese Journal of Applied Physics
Characterization of room temperature recrystallization kinetics in electroplated copper thin films with concurrent x-ray diffraction and electrical resistivity measurements
- Mikhail Treger
- Christian Witt
- et al.
- 2013
- Journal of Applied Physics