IMMERSION TIN: ITS CHEMISTRY, METALLURGY, AND APPLICATION IN ELECTRONIC PACKAGING TECHNOLOGY.
- Zlata Kovac
- K.N. Tu
- 1984
- IBM J. Res. Dev
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230 results for King-Ning Tu
Low-temperature redistribution of As in Si during Ni silicide formation
- I. Ohdomari
- M. Akiyama
- et al.
- 1984
- Journal of Applied Physics
Interfacial reaction and Schottky barrier between Pt and GaAs
- C. Fontaine
- T. Okumura
- et al.
- 1983
- Journal of Applied Physics
Interdiffusion in copper-aluminum thin film bilayers. II. Analysis of marker motion during sequential compound formation
- H.T.G. Hentzell
- K.N. Tu
- 1983
- Journal of Applied Physics
Analysis of parallel Schottky contacts by differential internal photoemission spectroscopy
- T. Okumura
- K.N. Tu
- 1983
- Journal of Applied Physics
Temperature dependence of structural and electrical properties of Ta-Si thin alloy films
- T. Tien
- G. Ottaviani
- et al.
- 1983
- Journal of Applied Physics
Intermetallic compound formation in thin-film and in bulk samples of the Ni-Si binary system
- K.N. Tu
- G. Ottaviani
- et al.
- 1983
- Journal of Applied Physics
Interaction between chromium oxide and chromium silicide
- A. Cros
- R.A. Pollak
- et al.
- 1983
- Journal of Applied Physics
Interaction of Pd-Er alloys with silicon
- G. Ottaviani
- K.N. Tu
- et al.
- 1983
- Journal of Applied Physics
Interdiffusion in copper-aluminum thin film bilayers. I. Structure and kinetics of sequential compound formation
- H.T.G. Hentzell
- R.D. Thompson
- et al.
- 1983
- Journal of Applied Physics