Finite-element modeling of stress distribution and migration in interconnecting studs of a three-dimensional multilevel device structure
- L.T. Shi
- K.N. Tu
- 1994
- Applied Physics Letters
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230 results for King-Ning Tu
Nonalloyed ohmic contacts to n-Si using a strained Si0.50Ge 0.50 buffer layer
- Hsing-Kuen Liou
- Edward S. Yang
- et al.
- 1993
- Applied Physics Letters
Thermal behavior of Al and Al-3 at. % Ge thin films on Si wafers
- B.S. Lim
- W.C. Pritchet
- et al.
- 1993
- Journal of Applied Physics
Microstructural changes in confined submicrometer aluminum films
- M.L. Chou
- S. Rishton
- et al.
- 1993
- Journal of Applied Physics
Stress evolution due to electromigration in confined metal lines
- M.A. Korhonen
- P. Borgesen
- et al.
- 1993
- Journal of Applied Physics
Solid phase amorphization and crystallization in multilayer and bilayer Rh-Si thin films
- S.R. Herd
- I.M. Fisher
- et al.
- 1993
- Materials Chemistry and Physics
Electrical and optical properties of silicide single crystals and thin films
- F. Nava
- K.N. Tu
- et al.
- 1993
- Materials Science Reports
Stress and phase changes in a low-thermal-expansion Al-3at.%Ge alloy film on oxidized silicon wafers
- K.N. Tu
- K.P. Rodbell
- et al.
- 1993
- Materials Chemistry and Physics
Interfacial reactions and Schottky barriers of Pt and Pd on epitaxial Si1-xGex alloys
- H.K. Liou
- X. Wu
- et al.
- 1992
- Applied Physics Letters
Nucleation and growth of Cu2O in the reduction of CuO thin films
- Jian Li
- J.W. Mayer
- et al.
- 1992
- Physical Review B