A study on the long-term degradation of crystalline silicon solar cells metallized with Cu electroplating
- Qiang Huang
- Kathleen B. Reuter
- et al.
- 2015
- ECS J. Solid State Sci. Technol.
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A study on the electrodeposition and silicidation of Nickel-Cobalt alloys for silicon photovoltaic cell metallization
- Qiang Huang
- 2015
- ECS J. Solid State Sci. Technol.
Light assisted electrodeposition and silicidation of Ni for silicon photovoltaic cell metallization
- Qiang Huang
- Satyavolu S. Papa Rao
- et al.
- 2015
- ECS J. Solid State Sci. Technol.
Tin incorporated in copper films during damascene copper electrodeposition
- S. Kitayaporn
- Qiang Huang
- et al.
- 2014
- JES
Electrochemical palladium deposition for reducing critical dimensions in nanostructures
- Asli Sahin
- Qiang Huang
- et al.
- 2014
- JES
Impurities in the electroplated sub-50 nm cu lines: The effects of the plating additives
- Qiang Huang
- A. Avekians
- et al.
- 2014
- JES
Electroplating of Fe-rich NiFe alloys in sub-50 nm lines
- D. Liang
- J. Liu
- et al.
- 2014
- JES
An electrochemical method of suppressor screening for Cu plating in sub-100 nm lines
- Qiang Huang
- J. Liu
- et al.
- 2014
- JES
Enhanced grain growth of electroplated copper on cobalt-containing seed layer
- Q. Huang
- B.C. Baker-O'Neal
- et al.
- 2013
- JES
Leveler effect and oscillatory behavior during copper electroplating
- Q. Huang
- B.C. Baker-O'Neal
- et al.
- 2012
- JES