Recrystallization as a Growth Mechanism for Whiskers on Plastically Deformed Sn Films
- Jaewon Chang
- Sung K. Kang
- et al.
- 2015
- Journal of Electronic Materials
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67 results for Sung K. Kang
Development of electroless nickel-iron plating process for microelectronic applications
- Yu Luo
- Sung K. Kang
- et al.
- 2014
- ECTC 2014
Effects of sodium citrate concentration on electroless Ni-Fe bath stability and deposition
- Myung-Won Jung
- Sung K. Kang
- et al.
- 2013
- Journal of Electronic Materials
Investigation of Sn whisker growth in electroplated Sn and Sn-Ag as a function of plating variables and storage conditions
- Jaewon Chang
- Sung K. Kang
- et al.
- 2013
- Journal of Electronic Materials
Plastic deformation effect on Sn whisker growth in electroplated Sn and Sn-Ag solders
- Sung K. Kang
- Jaewon Chang
- et al.
- 2013
- ECTC 2013
Systematic investigation of Sn-Ag and Sn-Cu modified by minor alloying element of titanium
- W.M. Chen
- S.K. Kang
- et al.
- 2012
- ECTC 2012
Effects of Ti addition to Sn-Ag and Sn-Cu solders
- W.M. Chen
- S.K. Kang
- et al.
- 2012
- Journal of Alloys and Compounds
Minor alloying effects of Ni or Zn on microstructure and microhardness of Pb-free solders
- Sun-Kyoung Seo
- Moon Gi Cho
- et al.
- 2011
- ECTC 2011
Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders
- Moon Gi Cho
- Sung K. Kang
- et al.
- 2011
- Journal of Materials Research
Electromigration performance of Pb-free solder joints in terms of solder composition and joining path
- Sun-Kyoung Seo
- Sung K. Kang
- et al.
- 2010
- JOM