Investigation of Sn whisker growth in electroplated Sn and Sn-Ag as a function of plating variables and storage conditions
- Jaewon Chang
- Sung K. Kang
- et al.
- 2013
- Journal of Electronic Materials
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67 results for Sung K. Kang
Effects of Ti addition to Sn-Ag and Sn-Cu solders
- W.M. Chen
- S.K. Kang
- et al.
- 2012
- Journal of Alloys and Compounds
Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders
- Moon Gi Cho
- Sung K. Kang
- et al.
- 2011
- Journal of Materials Research
Electromigration performance of Pb-free solder joints in terms of solder composition and joining path
- Sun-Kyoung Seo
- Sung K. Kang
- et al.
- 2010
- JOM
Effect of Zn doping on SnAg solder microstructure and electromigration stability
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- Journal of Applied Physics
The crystal orientation of β-Sn grains in Sn-Ag and Sn-Cu solders affected by their interfacial reactions with Cu and Ni(P) under bump metallurgy
- Sun-Kyoung Seo
- Sung K. Kang
- et al.
- 2009
- Journal of Electronic Materials
Interfacial reactions and microstructures of Sn-0.7Cu-xZn solders with ni-P UBM during thermal aging
- Moon Gi Cho
- Sung K. Kang
- et al.
- 2009
- Journal of Electronic Materials
The evolution of microstructure and microhardness of Sn-Ag and Sn-Cu solders during high temperature aging
- Sun-Kyoung Seo
- Sung K. Kang
- et al.
- 2009
- Microelectronics Reliability
An overview of Pb-free, flip-chip wafer-bumping technologies
- Sung K. Kang
- Peter Gruber
- et al.
- 2008
- JOM
An investigation of microstructure and microhardness of Sn-Cu and Sn-Ag solders as functions of alloy composition and cooling rate
- Sun-Kyoung Seo
- Sung K. Kang
- et al.
- 2008
- Journal of Electronic Materials