PtSi-Induced Junction Leakage
- J.P. Gambino
- M.D. Monkowski
- et al.
- 2019
- JES
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34 results for Jeffrey P. Gambino
An overview of through-silicon-via technology and manufacturing challenges
- Jeffrey P. Gambino
- Shawn A. Adderly
- et al.
- 2015
- Microelectronic Engineering
SiGe HBTs in 90nm BiCMOS technology demonstrating 300GHz/420GHz f T/fMAX through reduced Rb and Ccb parasitics
- Renata Camillo-Castillo
- Q. Liu
- et al.
- 2013
- BCTM 2013
Measurement of back end of line thermal resistance for 3D chip stacks
- E.G. Colgan
- R.J. Polastre
- et al.
- 2013
- SEMI-THERM 2013
Performance and reliability of thick Cu interconnects for RF and analog/mixed signal technology
- E. Cooney
- Jeff Gambino
- et al.
- 2013
- MRS Spring Meeting 2013
Improved frequency response in a SiGe npn device through improved dopant activation
- Jim Adkisson
- Marwan H. Khater
- et al.
- 2012
- ECS Meeting 2012
A self-aligned sacrificial emitter process for high performance SiGe HBT in BiCMOS
- Q. Liu
- Jim Adkisson
- et al.
- 2012
- ECS Meeting 2012
Experimental confirmation of electron fluence driven, Cu catalyzed interface breakdown model for low-k TDDB
- Fen Chen
- Jeffrey Gambino
- et al.
- 2012
- IRPS 2012
Interconnect processes and reliability for RF technology
- Jeffrey P. Gambino
- F. Anderson
- et al.
- 2011
- IPFA 2011
Stress characterization of tungsten-filled through silicon via arrays using very high resolution multi-wavelength raman spectroscopy
- Jeff Gambino
- Daniel Vanslette
- et al.
- 2011
- ECS Transactions