Tin incorporated in copper films during damascene copper electrodeposition
- S. Kitayaporn
- Qiang Huang
- et al.
- 2014
- JES
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14 results for Brett C. Baker-O'Neal
Electrochemical palladium deposition for reducing critical dimensions in nanostructures
- Asli Sahin
- Qiang Huang
- et al.
- 2014
- JES
Impurities in the electroplated sub-50 nm cu lines: The effects of the plating additives
- Qiang Huang
- A. Avekians
- et al.
- 2014
- JES
Electroplating of Fe-rich NiFe alloys in sub-50 nm lines
- D. Liang
- J. Liu
- et al.
- 2014
- JES
An electrochemical method of suppressor screening for Cu plating in sub-100 nm lines
- Qiang Huang
- J. Liu
- et al.
- 2014
- JES
Enhanced grain growth of electroplated copper on cobalt-containing seed layer
- Q. Huang
- B.C. Baker-O'Neal
- et al.
- 2013
- JES
Leveler effect and oscillatory behavior during copper electroplating
- Q. Huang
- B.C. Baker-O'Neal
- et al.
- 2012
- JES
Suppressor effects during copper superfilling of sub-100 nm lines
- Q. Huang
- B.C. Baker-O'Neal
- et al.
- 2009
- Electrochemical and Solid-State Letters
Electromigration reliability in nanoscale Cu interconnects
- C.-K. Hu
- L. Gignac
- et al.
- 2007
- MRS Fall Meeting 2007
The effect of microstructure on resistivity and reliability in copper interconnects
- Lynne M. Gignac
- C.-K. Hu
- et al.
- 2007
- AMC 2007