Electromigration analysis of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2011
- ECTC 2011
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19 results for Hirokazu Noma
Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections
- Katsuyuki Sakuma
- Kazushige Toriyama
- et al.
- 2011
- ECTC 2011
High-bandwidth density optical I/O for high-speed logic chip on waveguide-integrated organic carrier
- Masao Tokunari
- Yutaka Tsukada
- et al.
- 2011
- ECTC 2011
IMC bonding for 3D interconnection
- Katsuyuki Sakuma
- Kuniaki Sueoka
- et al.
- 2010
- ECTC 2010
Injection molded solder - a new fine pitch substrate bumping method
- Jae-Woong Nah
- Peter A. Gruber
- et al.
- 2009
- ECTC 2009
Ultrafine-pitch C2 flip chip interconnections with solder-capped Cu pillar bumps
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2009
- ECTC 2009
Warpage analysis of organic substrates for 2.1D packaging
- Sayuri Kohara
- Keishi Okamoto
- et al.
- 2015
- 3DIC 2015
Effects of low CTE materials on thermal deformation of organic substrates in flip chip package application
- Hiroyuki Mori
- Sayuri Kohara
- et al.
- 2015
- InterPACK 2015
Warpage modeling technique of organic interposer considering deformation by insulator material shrinkage
- Keishi Okamoto
- Sayuri Kohara
- et al.
- 2015
- ICEP-IAAC 2015
Scaling challenges of semiconductor packaging in the era of big data
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2013
- IMAPS 2013