PowerCool: Simulation of cooling and powering of 3D MPSoCs with integrated flow cell arrays
- Artem Aleksandrovich Andreev
- Arvind Sridhar
- et al.
- 2018
- IEEE TC
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11 results for David Atienza
ALPINE: Analog In-Memory Acceleration with Tight Processor Integration for Deep Learning
- Joshua Klein
- Irem Boybat
- et al.
- 2023
- IEEE TC
3D-ICE: A compact thermal model for early-stage design of liquid-cooled ICs
- Arvind Sridhar
- Alessandro Vincenzi
- et al.
- 2014
- IEEE TC
Architecting more than Moore: Wireless plasticity for massive heterogeneous computer architectures (WiPLASH)
- Joshua Klein
- Alexandre Levisse
- et al.
- 2021
- CF 2021
ICCAD 2015 contest in 3D interlayer cooling optimized network
- Arvind Sridhar
- Mohamed M. Sabry
- et al.
- 2015
- ICCAD 2015
PowerCool: Simulation of integrated microfluidic power generation in bright silicon MPSoCs
- Arvind Sridhar
- Mohamed M. Sabry
- et al.
- 2014
- ICCAD 2014
Integrated microfluidic power generation and cooling for bright silicon MPSoCs
- Mohamed M. Sabry
- Arvind Sridhar
- et al.
- 2014
- DATE 2014
STEAM: A fast compact thermal model for two-phase cooling of integrated circuits
- Arvind Sridhar
- Yassir Madhour
- et al.
- 2013
- ICCAD 2013
3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
- Arvind Sridhar
- Alessandro Viricenzi
- et al.
- 2010
- ICCAD 2010
Energy-efficient variable-flow liquid cooling in 3D stacked architectures
- Ayse K. Coskun
- David Atienza
- et al.
- 2010
- DATE 2010