Assembly and packaging of non-bumped 3D chip stacks on bumped substrates
- Bing Dang
- Joana Maria
- et al.
- 2014
- ECTC 2014
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59 results for Bing Dang
Factors in the selection of temporary wafer handlers for 3D/2.5D integration
- Bing Dang
- Bucknell Webb
- et al.
- 2014
- ECTC 2014
Advanced wafer bonding and laser debonding
- Paul Andry
- Russell A. Budd
- et al.
- 2014
- ECTC 2014
Transferrable fine pitch probe technology
- Y. Liu
- S.L. Wright
- et al.
- 2014
- ECTC 2014
NiFe-based Ball-limiting-metallurgy (BLM) for microbumps at 50μm pitch in 3D chip stacks
- Bing Dang
- Steven Wright
- et al.
- 2013
- ECTC 2013
Micro-interconnection reliability: Thermal, electrical and mechanical stress
- Steven L. Wright
- Cornelia Tsang
- et al.
- 2012
- ECTC 2012
2.5D and 3D technology challenges and test vehicle demonstrations
- John Knickerbocker
- Paul Andry
- et al.
- 2012
- ECTC 2012
3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections
- Joana Maria
- Bing Dang
- et al.
- 2011
- ECTC 2011
Low-profile 3D silicon-on-silicon multi-chip assembly
- Paul Andry
- Bing Dang
- et al.
- 2011
- ECTC 2011
CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration
- Bing Dang
- Paul Andry
- et al.
- 2010
- ECTC 2010