Publications

63 results for Bing Dang

Panel Packaging Approach to Micro Thin-film Battery Sealing for Healthcare and Internet of Things (IoT) Applications
- - Qianwen Chen
  - Bing Dang
  - et al.
- 2020
- ECTC 2020
Novel packaging structure and processes for micro-TFB (thin film battery) to enable miniaturized healthcare internet-of-things (IoT) devices
- - Bing Dang
  - Qianwen Chen
  - et al.
- 2019
- ECTC 2019
High-speed precision handling technology of micro-chip for fan-out wafer level packaging (FOWLP) application
- - Qianwen Chen
  - Li-Wen Hung
  - et al.
- 2018
- ECTC 2018
Heterogeneous integration technology demonstrations for future healthcare, IoT, and AI computing solutions
- - John Knickerbocker
  - Russell A. Budd
  - et al.
- 2018
- ECTC 2018
Modeling embedded two-phase liquid cooled high power 3D compatible electronic devices
- - Pritish R. Parida
  - Arvind Sridhar
  - et al.
- 2017
- SEMI-THERM 2017
Feasibility Study of Si Handler Debonding by Laser Release
- - Bing Dang
  - Thomas Wassick
  - et al.
- 2016
- ECTC 2016
Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
- - Bing Dang
  - Evan Colgan
  - et al.
- 2016
- ECTC 2016
Boiling sensitivity analysis of asymmetrically heated micro-scale devices
- - Fanghao Yang
  - Mark D. Schultz
  - et al.
- 2016
- ITherm 2016
Embedded two-phase cooling of large three-dimensional compatible chips with radial channels
- - Mark D. Schultz
  - Fanghao Yang
  - et al.
- 2016
- ASME Journal of Electronic Packaging
An 82%-efficient multiphase voltage-regulator 3D interposer with on-chip magnetic inductors
- - Kevin Tien
  - Noah Sturcken
  - et al.
- 2015
- VLSI Circuits 2015