3D chip stacking with C4 technology
- Bing Dang
- Steven L. Wright
- et al.
- 2008
- IBM J. Res. Dev
Publications
63 results for Bing Dang
Fabrication and characterization of robust through-silicon vias for silicon-carrier applications
- Paul S. Andry
- Cornelia K. Tsang
- et al.
- 2008
- IBM J. Res. Dev
3D chip-stacking technology with through-silicon vias and low-volume lead free interconnections
- Katsuyuki Sakuma
- Paul S. Andry
- et al.
- 2008
- IBM J. Res. Dev
Three-dimensional silicon integration
- John U. Knickerbocker
- Paul S. Andry
- et al.
- 2008
- IBM J. Res. Dev
Lead free micro bumping - Cost & yield challenges
- Klaus Ruhmer
- Emmett Hughlett
- et al.
- 2007
- EPTC 2007
Assembly, characterization, and reworkability of Pb-free ultra-fine pitch C4s for system-on-package
- B. Dang
- S.L. Wright
- et al.
- 2007
- ECTC 2007
'Trimodal' wafer-level package: Fully compatible electrical, optical, and fluidic chip I/O interconnects
- Muhannad S. Bakir
- Bing Dang
- et al.
- 2007
- ECTC 2007
3D chip stacking technology with low-volume lead-free interconnections
- K. Sakuma
- P. Andry
- et al.
- 2007
- ECTC 2007
Electromigration resistant power delivery systems
- Deepak C. Sekar
- Bing Dang
- et al.
- 2007
- IEEE Electron Device Letters
Sea-of-Leads MEMS I/O interconnects for low-k IC packaging
- Bing Dang
- Muhannad S. Bakir
- et al.
- 2006
- JMEMS