Vacuum underfill technology for advanced packaging (IMPACT 2011)
- M. Hoshiyama
- M. Hasegawa
- et al.
- 2011
- IMPACT 2011
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56 results for Katsuyuki Sakuma
Investigations of fluxless flip-chip bonding using vacuum ultraviolet and formic acid vapor surface treatment
- Naoko Unami
- Hirokazu Noma
- et al.
- 2011
- APM 2011
Back to Finger-Writing: Fingertip Writing Technology Based on Pressure Sensing
- Gaddi Blumrosen
- Katsuyuki Sakuma
- et al.
- 2020
- IEEE Access
Development trend of three-dimensional (3D) integration technology
- 2011
- IEEJ Transactions on Sensors and Micromachines
Healthcare Wearable Sensors Adhesion to Human Fingernails and Toenails
- Katsuyuki Sakuma
- Leanna Pancoast
- et al.
- 2023
- Micromachines
Fabrication and Performance of 300-mm Wafer-Scale Silicon Microchannel Cooler
- Evan G. Colgan
- Kai Schleupen
- et al.
- 2023
- IEEE Transactions on CPMT
3-D Die Stacking with 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- IEEE Transactions on CPMT
CMOS-Compatible Wearable Sensors Fabricated Using Controlled Spalling
- Katsuyuki Sakuma
- Huan Hu
- et al.
- 2019
- IEEE Sensors Journal
Hybrid au-adhesive bonding using planar adhesive structure for 3-D LSI
- Masatsugu Nimura
- Jun Mizuno
- et al.
- 2014
- IEEE Transactions on CPMT
Development of vacuum underfill technology for a 3D chip stack
- Katsuyuki Sakuma
- Sayuri Kohara
- et al.
- 2011
- JMM