Morphology of Low-Temperature All-Copper Interconnects Formed by Dip Transfer
- Luca Del Carro
- Jonas Zuercher
- et al.
- 2017
- ECTC 2017
Publications
159 results for Thomas Brunschwiler
Direct investigation of microparticle self-assembly to improve the robustness of neck formation in thermal underfills
- Roman Stadler
- Luca Del Carro
- et al.
- 2017
- ITherm 2017
Thermal performance of a silicon-interposer with embedded fluid channels enabling dual-side heat removal
- Ozgur Ozsun
- Stephan Paredes
- et al.
- 2017
- ITherm 2017
Thermal model for embedded two-phase liquid cooled microprocessor
- Pritish R. Parida
- Arvind Sridhar
- et al.
- 2017
- ITherm 2017
Modeling embedded two-phase liquid cooled high power 3D compatible electronic devices
- Pritish R. Parida
- Arvind Sridhar
- et al.
- 2017
- SEMI-THERM 2017
Relief printing of micron-sized electrical conductive structures on silicon
- S. Gerke
- Jonas Zürcher
- et al.
- 2017
- Flexible and Printed Electronics
Scalable packaging platform supporting high-performance 3D chip stacks
- Thomas Brunschwiler
- Gerd Schlottig
- et al.
- 2017
- Pan Pacific 2017
Enhanced percolating thermal underfills achieved by means of nanoparticle bridging necks
- Jonas Zürcher
- Xi Chen
- et al.
- 2016
- IEEE Transactions on CPMT
Exploration of inductor-based hybrid integrated voltage regulator architectures
- Arvind Sridhar
- Thomas Brunschwiler
- et al.
- 2016
- ESTC 2016
Dual-side heat removal by micro-channel cold plate and silicon-interposer with embedded fluid channels
- Thomas Brunschwiler
- Raúl Mroßko
- et al.
- 2016
- ESTC 2016