RaPiD: AI Accelerator for Ultra-Low Precision Training and Inference
- Swagath Venkataramani
- Vijayalakshmi Srinivasan
- et al.
- 2021
- ISCA 2021
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38 results for Michael Scheuermann
A 7nm 4-Core AI Chip with 25.6TFLOPS Hybrid FP8 Training, 102.4TOPS INT4 Inference and Workload-Aware Throttling
- Ankur Agrawal
- Saekyu Lee
- et al.
- 2021
- ISSCC 2021
Assembly and packaging of non-bumped 3D chip stacks on bumped substrates
- Bing Dang
- Joana Maria
- et al.
- 2014
- ECTC 2014
Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks
- Zheng Xu
- Xiaoxiong Gu
- et al.
- 2012
- ECTC 2012
Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs
- Xin Zhao
- Michael Scheuermann
- et al.
- 2012
- DAC 2012
A 3D system prototype of an eDRAM cache stacked over processor-like logic using through-silicon vias
- Matt Wordeman
- Joel Silberman
- et al.
- 2012
- ISSCC 2012
A high-speed silicon metal-semiconductor-metal photodetector fully integrable with (Bi)CMOS circuits
- E. Bassous
- M. Scheuermann
- et al.
- 1991
- IEDM 1991
MINORITY CARRIER TRANSPORT IN SILICON.
- D.D. Tang
- F. Fang
- et al.
- 1985
- IEDM 1985
A 7-nm Four-Core Mixed-Precision AI Chip with 26.2-TFLOPS Hybrid-FP8 Training, 104.9-TOPS INT4 Inference, and Workload-Aware Throttling
- Sae Kyu Lee
- Ankur Agrawal
- et al.
- 2021
- IEEE JSSC
Anomalous Voltage Overshoot During Turn-Off of Thin-Film n-Channel SOI MOSFET's
- E. Dubois
- Ghavam G. Shahidi
- et al.
- 1993
- IEEE Electron Device Letters