Flip-chip III-V-to-silicon photonics interfaces for optical sensor
- Yves Martin
- Jason S. Orcutt
- et al.
- 2019
- ECTC 2019
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76 results for Laurent Schares
A Four-Channel Silicon Photonic Carrier with Flip-Chip Integrated Semiconductor Optical Amplifier (SOA) Array Providing >10-dB Gain
- Fuad Doany
- Russell A. Budd
- et al.
- 2016
- ECTC 2016
Semiconductor optical amplifier (SOA) packaging for scalable and gain-integrated silicon photonic switching platforms
- Russell A. Budd
- Laurent Schares
- et al.
- 2015
- ECTC 2015
160-Gb/s bidirectional parallel optical transceiver module for board-level interconnects using a single-chip CMOS IC
- Fuad E. Doany
- Clint L. Schow
- et al.
- 2007
- ECTC 2007
Chic-sched: a HPC Placement-Group Scheduler on Hierarchical Topologies with Constraints
- Laurent Schares
- Asser Tantawi
- et al.
- 2023
- IPDPS 2023
An 800 Gb/s, 16 channel, VCSEL-based, co-packaged transceiver with fast laser sparing
- Daniel M. Kuchta
- Mounir Meghelli
- et al.
- 2022
- ECOC 2022
MOTION: A High speed, low cost, low energy chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Centers
- Daniel M. Kuchta
- Mounir Meghelli
- et al.
- 2022
- Networks 2022
Intra-node High-performance Computing Network Architecture with Fast Optical Switch Fabrics
- Pavlos Maniotis
- Nicolas Dupuis
- et al.
- 2022
- OECC/PSC 2022
Co-packaged optics for HPC and data center networks
- Pavlos Maniotis
- Laurent Schares
- et al.
- 2021
- SPIE OPTO 2021
Scaling HPC Networks with Co-Packaged Optics
- Pavlos Maniotis
- Laurent Schares
- et al.
- 2020
- OFC 2020